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楼主: 蚂蚁小弟

【HTPADU 5028 交流专区】海德

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发表于 31-3-2020 04:08 AM | 显示全部楼层
HEITECH PADU BERHAD

Type
Announcement
Subject
OTHERS
Description
ACCEPTANCE ON THE LETTER OF AWARD (LOA) FOR RENEWAL OF LICENSES AND MAINTENANCE OF IBM SOFTWARE FOR MAINFRAME SYSTEMS IN LEMBAGA HASIL DALAM NEGERI
ACCEPTANCE ON THE LETTER OF AWARD (“LOA”) FOR RENEWAL OF LICENSES AND MAINTENANCE OF IBM SOFTWARE FOR MAINFRAME SYSTEMS IN LEMBAGA HASIL DALAM NEGERI

1.         Introduction

HeiTech Padu Berhad (“HeiTech” or “the Company”) is pleased to announce that the Company has, on 23 December 2019, signed the LOA for Renewal of Licenses and Maintenance of IBM Software for Mainframe Systems in Lembaga Hasil Dalam Negeri (“LHDN”).

2.         The Contract Value

The Contract Value is RM34,800,000.00 (Ringgit Malaysia Thirty Four Million Eight Hundred Thousand Only).

3.         Duration of the Contract

The Contract is for a period of Two (2) years commencing from 1 January 2020 to 31 December 2021.

4.         The effect on net assets of HeiTech Group

The Contract will not have any effect on HeiTech Group’s net asset for the financial year ending 31 December 2019.

5.         The risks in relation to the Contract

The risks are normal risks encountered by companies undertaking a similar endeavor and the Company has taken the necessary steps to protect itself and to mitigate the risks as and when they occur.

6.         Directors' and Substantial Shareholders' Interest

None of the Directors or substantial shareholders or any person connected to the Directors or substantial shareholders of HeiTech has any interest, either direct or indirect in the above Contract.

7.         Statement of the Directors

The Board of Directors is of the opinion that the execution of the Contract is in the ordinary course of business and is in the best interest of the Company.

8.         Financial effects

The Contract is expected to have positive effects on future earnings and earnings per share of HeiTech. Nevertheless, the Contract will have no material effect to the dividend policy, share capital and substantial shareholdings of the Company for the financial year ending 31 December 2019.

This announcement is dated 23 December 2019.



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发表于 2-4-2020 06:29 AM | 显示全部楼层
icy97 发表于 29-3-2020 08:26 AM
https://www.bursamalaysia.com/market_information/announcements/company_announcement/announcement_details?ann_id=3011171

Type
Announcement
Subject
OTHERS
Description
DISPOSAL OF 6,900,000 ORDINARY SHARES IN DAPAT VISTA (M) SDN BHD. ("DAPAT") ("DISPOSAL")
We refer to the announcement dated 20 December 2019 (“Announcement”).

Unless stated otherwise, definitions used in this reply shall carry the same meaning as defined in the Announcement.

The Board wishes to clarify on the following:-

The particulars of:-
  • any liabilities, including contingent liabilities, in relation to the Disposal which remain with HTPADU, together with the details and justification for such arrangements; and
  • any guarantees given by HTPADU to TASB or DAPAT.
There are no liabilities, including contingent liabilities, in relation to the Disposal which remain with HTPADU; and

There are no guarantees given by HTPADU to TASB or DAPAT.

The basis of arriving at the sale consideration, other than on a “willing buyer willing seller” basis and the justification for the sale consideration.

The consideration for the Disposal of RM13.5 million was arrived at on a willing buyer willing seller basis, after taking into consideration the projected future earnings of DAPAT from its new revenue stream.  

During negotiations, the earnings before tax, interest and depreciation/amortisation of DAPAT in 5 years were projected to be about RM22.5 million. Since HeiTech wished to reduce its shareholding in DAPAT from 80% to 20%, the equivalent value of the earnings surrendered is RM13.5 million. The amount was subsequently agreed by both parties as the consideration for the Disposal.  

The breakdown of the type of working capital and the timeframe for full utilisation of proceeds.

The group intends to utilise the proceeds of the Disposal of RM13,500,000 by:-
  • Embarking in new business ventures = RM5,000,000.00
  • Working capital = RM8,500,000.00
The RM5,000,000.00 would be utilised within 6-12 months and it will be invested in development of new products and technologies relating to Information and Communication Technology in order to cater for local and overseas market.

The balance of the proceeds would be used as working capital and utilised accordingly throughout the remaining payment period.

The period and time during with the Agreement will be available for inspection.

The Agreement is available for inspection for a period of 3 months from the date of the signing of the SPA, at the registered office of HeiTech during office hours, from Monday to Friday (excluding public holidays) at Level 15, Menara HeiTech Village, Persiaran Kewajipan, USJ 1, UEP Subang Jaya, 47600 Subang Jaya, Selangor Darul Ehsan.

This announcement is dated 30 December 2019.



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发表于 2-5-2020 07:16 AM | 显示全部楼层
SUMMARY OF KEY FINANCIAL INFORMATION
31 Dec 2019
INDIVIDUAL PERIOD
CUMULATIVE PERIOD
CURRENT YEAR QUARTER
PRECEDING YEAR
CORRESPONDING
QUARTER
CURRENT YEAR TO DATE
PRECEDING YEAR
CORRESPONDING
PERIOD
31 Dec 2019
31 Dec 2018
31 Dec 2019
31 Dec 2018
$$'000
$$'000
$$'000
$$'000
1Revenue
81,126
74,871
361,033
379,446
2Profit/(loss) before tax
5,589
-38,535
6,659
-36,431
3Profit/(loss) for the period
5,540
-37,796
6,147
-36,786
4Profit/(loss) attributable to ordinary equity holders of the parent
5,297
-30,390
7,105
-27,064
5Basic earnings/(loss) per share (Subunit)
5.23
-30.02
7.02
-26.74
6Proposed/Declared dividend per share (Subunit)
0.00
0.00
0.00
0.00


AS AT END OF CURRENT QUARTER
AS AT PRECEDING FINANCIAL YEAR END
7
Net assets per share attributable to ordinary equity holders of the parent ($$)
1.0300
0.9500

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发表于 30-5-2020 07:59 AM | 显示全部楼层
Type
Announcement
Subject
OTHERS
Description
ACCEPTANCE ON THE LETTER OF AWARD (LOA) FOR SUPPLYING, DELIVERING, INSTALLING, TESTING, INTEGRATING AND COMMISSIONING OF HARDWARE AND SOFTWARE UPGRADE TO STRENGTHEN CORE BUSINESS APPLICATION AT THE JABATAN PENDAFTARAN NEGARA
ACCEPTANCE ON THE LETTER OF AWARD (“LOA”) FOR SUPPLYING, DELIVERING, INSTALLING, TESTING, INTEGRATING AND COMMISSIONING OF HARDWARE AND SOFTWARE UPGRADE TO STRENGTHEN CORE BUSINESS APPLICATION AT THE JABATAN PENDAFTARAN NEGARA.

1.         Introduction

HeiTech Padu Berhad (“HeiTech” or “the Company”) is pleased to announce that the Company has, on 22 April 2020, signed the LOA for Supplying, Delivering, Installing, Testing, Integrating and Commissioning of Hardware and Software Upgrade to Strengthen Core Business Application at the Jabatan Pendaftaran Negara (JPN).

2.         The Contract Value

The Contract Value is RM19,898,989.00 (Ringgit Malaysia Nineteen Million Eight Hundred Ninety Eight Thousand Nine Hundred Eighty Nine Only).

3.         Duration of the Contract

The Contract is for a period of Twenty Four (24) months commencing from 1 May 2020 to 30 April 2022.

4.         The effect on net assets of HeiTech Group

The Contract will not have any effect on HeiTech Group’s net asset for the financial year ending 31 December 2020.

5.         The risks in relation to the Contract

The risks are normal risks encountered by companies undertaking a similar endeavour and the Company has taken the necessary steps to protect itself and to mitigate the risks as and when they occur.

6.         Directors' and Substantial Shareholders' Interest

None of the Directors or substantial shareholders or any person connected to the Directors or substantial shareholders of HeiTech has any interest, either direct or indirect in the above Contract.

7.         Statement of the Directors

The Board of Directors is of the opinion that the execution of the Contract is in the ordinary course of business and is in the best interest of the Company.

8.         Financial effects

The Contract is expected to have positive effects on future earnings and earnings per share of HeiTech. Nevertheless, the Contract will have no material effect on the dividend policy, share capital and substantial shareholdings of the Company for the financial year ending 31 December 2020.

This announcement is dated 22 April 2020.
https://www.bursamalaysia.com/market_information/announcements/company_announcement/announcement_details?ann_id=3045516

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发表于 9-6-2020 08:31 AM | 显示全部楼层
Type
Announcement
Subject
OTHERS
Description
ACCEPTANCE ON THE LETTER OF AWARD (LOA) FOR MAINTENANCE AND TECHNICAL SUPPORT SERVICES FOR HARDWARE AND SOFTWARE OF MAINFRAME SYSTEMS FOR THE ROAD TRANSPORT DEPARTMENT OF MALAYSIA (JPJ)
ACCEPTANCE ON THE LETTER OF AWARD (“LOA”) FOR MAINTENANCE AND TECHNICAL SUPPORT SERVICES FOR HARDWARE AND SOFTWARE OF MAINFRAME SYSTEMS FOR THE ROAD TRANSPORT DEPARTMENT OF MALAYSIA (“JPJ”)

1.         Introduction

HeiTech Padu Berhad (“HeiTech” or “the Company”) is pleased to announce that the Company has, on 21 May 2020, signed the LOA for Maintenance and Technical Support Services for Hardware and Software of Mainframe Systems for the Road Transport Department of Malaysia (“JPJ”).

2.         The Contract Value

The Contract Value is RM126,021,280.00 (Ringgit Malaysia One Hundred Twenty Six Million Twenty One Thousand Two Hundred Eighty Only).

3.         Duration of the Contract

The Contract is for a period of Twenty Nine (29) months commencing from 1 May 2020 to 30 September 2022.

4.         The effect on net assets of HeiTech Group

The Contract will not have any effect on HeiTech Group’s net asset for the financial year ending 31 December 2020.

5.         The risks in relation to the Contract

The risks are normal risks encountered by companies undertaking a similar endeavour and the Company has taken the necessary steps to protect itself and to mitigate the risks as and when they occur.

6.         Directors' and Substantial Shareholders' Interest

None of the Directors or substantial shareholders or any person connected to the Directors or substantial shareholders of HeiTech has any interest, either direct or indirect in the above Contract.

7.         Statement of the Directors

The Board of Directors is of the opinion that the execution of the Contract is in the ordinary course of business and is in the best interest of the Company.

8.         Financial effects

The Contract is expected to have positive effects on future earnings and earnings per share of HeiTech. Nevertheless, the Contract will have no material effect on the dividend policy, share capital and substantial shareholdings of the Company for the financial year ending 31 December 2020.

This announcement is dated 21 May 2020.



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发表于 8-9-2020 06:40 PM | 显示全部楼层
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发表于 10-10-2020 08:40 AM | 显示全部楼层
SUMMARY OF KEY FINANCIAL INFORMATION
31 Mar 2020
INDIVIDUAL PERIOD
CUMULATIVE PERIOD
CURRENT YEAR QUARTER
PRECEDING YEAR
CORRESPONDING
QUARTER
CURRENT YEAR TO DATE
PRECEDING YEAR
CORRESPONDING
PERIOD
31 Mar 2020
31 Mar 2019
31 Mar 2020
31 Mar 2019
$$'000
$$'000
$$'000
$$'000
1Revenue
74,740
70,073
74,740
70,073
2Profit/(loss) before tax
1,291
-878
1,291
-878
3Profit/(loss) for the period
1,189
-1,010
1,189
-1,010
4Profit/(loss) attributable to ordinary equity holders of the parent
1,310
-902
1,310
-902
5Basic earnings/(loss) per share (Subunit)
1.29
-0.89
1.29
-0.89
6Proposed/Declared dividend per share (Subunit)
0.00
0.00
0.00
0.00


AS AT END OF CURRENT QUARTER
AS AT PRECEDING FINANCIAL YEAR END
7
Net assets per share attributable to ordinary equity holders of the parent ($$)
1.0700
1.0500

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发表于 31-12-2020 09:27 AM | 显示全部楼层
SUMMARY OF KEY FINANCIAL INFORMATION
30 Jun 2020
INDIVIDUAL PERIOD
CUMULATIVE PERIOD
CURRENT YEAR QUARTER
PRECEDING YEAR
CORRESPONDING
QUARTER
CURRENT YEAR TO DATE
PRECEDING YEAR
CORRESPONDING
PERIOD
30 Jun 2020
30 Jun 2019
30 Jun 2020
30 Jun 2019
$$'000
$$'000
$$'000
$$'000
1Revenue
80,959
69,529
155,699
139,602
2Profit/(loss) before tax
4,499
1,769
5,790
891
3Profit/(loss) for the period
3,931
1,615
5,120
605
4Profit/(loss) attributable to ordinary equity holders of the parent
4,496
2,053
5,806
1,151
5Basic earnings/(loss) per share (Subunit)
4.44
2.03
5.74
1.14
6Proposed/Declared dividend per share (Subunit)
0.00
0.00
0.00
0.00


AS AT END OF CURRENT QUARTER
AS AT PRECEDING FINANCIAL YEAR END
7
Net assets per share attributable to ordinary equity holders of the parent ($$)
1.1000
1.0500

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发表于 12-3-2021 08:15 AM | 显示全部楼层
Notice of Person Ceasing (Section 139 of CA 2016)
HEITECH PADU BERHAD
Particulars of Substantial Securities Holder
Name
ASIA INTERNET HOLDINGS SDN BHD
Address
B-3-9, 3rd Floor
Block B Megan Avenue II
12 Jalan Yap Kwan Seng
Kuala Lumpur
50450 Wilayah Persekutuan
Malaysia.
Company No.
199801007297 (463424-W)
Nationality/Country of incorporation
Malaysia
Descriptions (Class)
Ordinary Share
Name of registered holder
ASIA INTERNET HOLDINGS SDN BHD
Address of registered holder
B-3-9, 3rd Floor Block B Megan Avenue II 12 Jalan Yap Kwan Seng Kuala Lumpur 50450 Wilayah Persekutuan Malaysia.
Date of cessation
20 Oct 2020
No of securities disposed
1,793,400
Circumstances by reason of which a person ceases to be a substantial shareholder
Disposal of shares
Nature of interest
Direct Interest
Date of notice
20 Oct 2020
Date notice received by Listed Issuer
21 Oct 2020

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发表于 23-3-2021 07:25 AM | 显示全部楼层
本帖最后由 icy97 于 12-9-2021 12:08 PM 编辑

Type
Announcement
Subject
OTHERS
Description
ACCEPTANCE ON THE LETTER OF AWARD (LOA) FOR PERKHIDMATAN PENYELENGGARAAN SISTEM APLIKASI DAN SOKONGAN TEKNIKAL BISNES UTAMA (BUICT) SECARA KOMPREHENSIF DI JABATAN PENDAFTARAN NEGARA (JPN)
ACCEPTANCE ON THE LETTER OF AWARD (“LOA”) FOR "PERKHIDMATAN PENYELENGGARAAN SISTEM APLIKASI DAN SOKONGAN TEKNIKAL BISNES UTAMA (BUICT) SECARA KOMPREHENSIF DI JABATAN PENDAFTARAN NEGARA (JPN)"

1.         Introduction

HeiTech Padu Berhad (“HeiTech” or “the Company”) is pleased to announce that the Company has, on 28.10.2020, signed the LOA “Perkhidmatan Penyelenggaraan Sistem Aplikasi dan Sokongan Teknikal Bisnes Utama (BUICT) Secara Komprehensif di Jabatan Pendaftaran Negara (JPN)”.

2.         The Contract Value

The Contract Value is RM50,973,280.00 (Ringgit Malaysia Fifty Million Nine Hundred Seventy-Three Thousand Two Hundred Eighty Only).

3.         Duration of the Contract

The Contract is for a period of Thirty Six Months (36) months commencing from 1 November 2020 to 31 October 2023.

4.         The effect on net assets of HeiTech Group

The Contract will not have any effect on HeiTech Group’s net asset for the financial year ending 31 December 2020.

5.         The risks in relation to the Contract

The risks are normal risks encountered by companies undertaking a similar endeavour and the Company has taken the necessary steps to protect itself and to mitigate the risks as and when they occur.

6.         Directors' and Substantial Shareholders' Interest

None of the Directors or substantial shareholders or any person connected to the Directors or substantial shareholders of HeiTech has any interest, either direct or indirect in the above Contract.

7.         Statement of the Directors

The Board of Directors is of the opinion that the execution of the Contract is in the ordinary course of business and is in the best interest of the Company.

8.         Financial effects

The Contract is expected to have positive effects on future earnings and earnings per share of HeiTech. Nevertheless, the Contract will have no material effect on the dividend policy, share capital and substantial shareholdings of the Company for the financial year ending 31 December 2020.

This announcement is dated 28 October 2020.


SUMMARY OF KEY FINANCIAL INFORMATION
30 Sep 2020
INDIVIDUAL PERIOD
CUMULATIVE PERIOD
CURRENT YEAR QUARTER
PRECEDING YEAR
CORRESPONDING
QUARTER
CURRENT YEAR TO DATE
PRECEDING YEAR
CORRESPONDING
PERIOD
30 Sep 2020
30 Sep 2019
30 Sep 2020
30 Sep 2019
$$'000
$$'000
$$'000
$$'000
1Revenue
101,960
140,305
257,659
279,907
2Profit/(loss) before tax
6,130
179
11,920
1,070
3Profit/(loss) for the period
6,517
2
11,637
607
4Profit/(loss) attributable to ordinary equity holders of the parent
3,196
657
9,002
1,808
5Basic earnings/(loss) per share (Subunit)
3.16
0.65
8.89
1.79
6Proposed/Declared dividend per share (Subunit)
0.00
0.00
0.00
0.00


AS AT END OF CURRENT QUARTER
AS AT PRECEDING FINANCIAL YEAR END
7
Net assets per share attributable to ordinary equity holders of the parent ($$)
1.1600
1.0500




Type
Announcement
Subject
OTHERS
Description
MEMORANDUM OF UNDERSTANDING (MOU) BETWEEN HEITECH PADU BERHAD AND REGAL ORION SDN. BHD. (RO)
MEMORANDUM OF UNDERSTANDING (“MOU”) BETWEEN HEITECH PADU BERHAD AND REGAL ORION SDN. BHD. (“RO”)

1.            Introduction
HeiTech Padu Berhad (“HeiTech” or “the Company”)   wishes to announce that the Company has on 26 November 2020 entered into a non-legally binding Memorandum of Understanding ("MOU") with Regal Orion Sdn. Bhd. ("RO”) (collectively referred to as the “Parties” and each as a “Party”) to explore all possible business collaboration to unlock the potential business synergy via its respective competitive advantage and seek to enhance the data centre related business activities in Malaysia

2.            Information on RO
RO is a company incorporated in Malaysia and having its registered office at Ground Floor, 8, Lorong Universiti B, Section 16, Petaling Jaya, 46200 Selangor, Malaysia. and business address at B-8-8, ICON City, Jalan SS8/39, 47300 Petaling Jaya, Selangor.

The principal activities of RO are the involvement in engineering, construction and project management specifically in the data centre development sector and activities ancillary thereto. RO is currently undertaking a Tier IV Data Centre at Techpark @ Bandar Enstek, Labu, Seremban, Negeri Sembilan.

3.            Rationale of the MOU
HeiTech is well-established in the data centre business with a Tier-IV ready data centre situated at HeiTech Village 2, Bukit Jelutong, Shah Alam, Selangor Darul Ehsan. The MOU will enable the Parties to explore future data centre business potential in large customer market segment in Malaysia.

4.            Salient Terms of the MOU
With this MOU, the Parties shall explore all possible business collaboration to unlock the potential business synergy via its respective competitive advantage and seek to enhance the data centre related business activities in Malaysia. These include sharing information in related data centre related business technical competencies and exploring future business potential in large customer market segment in Malaysia.

5.            Duration and Termination
Within ninety (90) days from the date of the MOU the Parties shall enter into a Definitive Agreement to define their relationships in more detail relating to the performance of any collaboration (hereinafter referred to as "the Definitive Agreement").

Upon the execution of the Definitive Agreement or lapse of Ninety (90) days (whichever earlier), the MOU shall automatically terminate and be of no effect, unless the MOU is mutually extended.

6.            Financial Effects of the MOU
The MOU is not expected to have any material effects on the net assets per share, earnings per share, gearing, share capital and substantial shareholders’ shareholding of the Company for the financial year ending 31 December 2020.  

7.            Approvals Required
The MOU is not subject to the approval of the shareholders of the Company or any relevant authorities.

8.            Directors’ and Major Shareholders’ Interest
None of the directors, major shareholders of the Company and persons connected to them have any interest direct and/or indirect in the MOU.

9.            Directors’ Statement
The Board, having considered all aspects of the MOU, is of the opinion that the MOU is in the best interest of the Company.

10.          Documents Available for Inspection
The MOU will be made available for inspection at the registered office of HeiTech located at Level 15 HeiTech Village, Persiaran Kewajipan, USJ 1 UEP Subang Jaya, 47600 Subang Jaya, Selangor Darul Ehsan for a period of three (3) months from the date of this announcement.

This announcement is date 26 November 2020.



Notice of Interest Sub. S-hldr (Section 137 of CA 2016)
HEITECH PADU BERHAD
Particulars of Substantial Securities Holder
Name
ASIA INTERNET HOLDINGS SDN BHD
Address
B-3-9, 3rd Floor
Block B Megan Avenue II
12 Jalan Yap Kwan Seng
Kuala Lumpur
50450 Wilayah Persekutuan
Malaysia.
Company No.
199801007297 (463424-W)
Nationality/Country of incorporation
Malaysia
Descriptions (Class)
Ordinary Share
Name of registered holder
ASIA INTERNET HOLDINGS SDN BHD
Address of registered holder
B-3-9, 3rd Floor, Block B Megan Avenue II12 Jalan Yap Kwan Seng50450 Kuala LumpurW.P. Kuala Lumpur Malaysia
Date interest acquired & no of securities acquired
Date interest acquired
06 Jan 2021
No of securities
620,000
Circumstances by reason of which Securities Holder has interest
Acquisition of shares
Nature of interest
Direct Interest
Total no of securities after change
Direct (units)
5,397,800
Direct (%)
5.332
Indirect/deemed interest (units)

Indirect/deemed interest (%)
Date of notice
08 Jan 2021
Date notice received by Listed Issuer
08 Jan 2021



Type
Announcement
Subject
OTHERS
Description
ACCEPTANCE ON THE LETTER OF AWARD (LOA) FOR RENEWAL OF CA GEN (TSO)  AND REPORT COMPOSER SYSTEM LICENSE FOR LEMBAGA HASIL DALAM NEGERI (LHDN)
ACCEPTANCE ON THE LETTER OF AWARD (“LOA”) FOR RENEWAL OF CA GEN (TSO)  AND REPORT COMPOSER SYSTEM LICENSE FOR LEMBAGA HASIL DALAM NEGERI (LHDN)


1.         Introduction

HeiTech Padu Berhad (“HeiTech” or “the Company”) is pleased to announce that the Company has, on 13.1.2021, signed the LOA for Renewal of CA GEN (TSO) and Report Composer System License Mainframe, for Lembaga Hasil Dalam Negeri (LHDN).

2.         The Contract Value

The Contract Value is RM35,200,000.00 (Ringgit Malaysia Thirty Five Million Two Hundred Thousand Only).

3.         Duration of the Contract

The Contract is for a period of Three (3) years commencing from 1 February 2021 to 31 January 2024.

4.         The effect on net assets of HeiTech Group

The Contract will not have any effect on HeiTech Group’s net asset for the financial year ending 31 December 2021.

5.         The risks in relation to the Contract

The risks are normal risks encountered by companies undertaking a similar endeavour and the Company has taken the necessary steps to protect itself and to mitigate the risks as and when they occur.

6.         Directors' and Substantial Shareholders' Interest

None of the Directors or substantial shareholders or any person connected to the Directors or substantial shareholders of HeiTech has any interest, either direct or indirect in the above Contract.

7.         Statement of the Directors

The Board of Directors is of the opinion that the execution of the Contract is in the ordinary course of business and is in the best interest of the Company.

8.         Financial effects

The Contract is expected to have positive effects on future earnings and earnings per share of HeiTech. Nevertheless, the Contract will have no material effect on the dividend policy, share capital and substantial shareholdings of the Company for the financial year ending 31 December 2021

This announcement is dated 13 January 2021.

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发表于 13-2-2022 08:11 AM | 显示全部楼层
SUMMARY OF KEY FINANCIAL INFORMATION
30 Sep 2021
INDIVIDUAL PERIOD
CUMULATIVE PERIOD
CURRENT YEAR QUARTER
PRECEDING YEAR
CORRESPONDING
QUARTER
CURRENT YEAR TO DATE
PRECEDING YEAR
CORRESPONDING
PERIOD
30 Sep 2021
30 Sep 2020
30 Sep 2021
30 Sep 2020
$$'000
$$'000
$$'000
$$'000
1Revenue
68,893
101,960
200,814
257,659
2Profit/(loss) before tax
286
6,130
2,169
11,920
3Profit/(loss) for the period
259
6,517
2,044
11,637
4Profit/(loss) attributable to ordinary equity holders of the parent
854
3,196
1,456
9,002
5Basic earnings/(loss) per share (Subunit)
0.84
3.16
1.44
8.89
6Proposed/Declared dividend per share (Subunit)
0.00
0.00
0.00
0.00


AS AT END OF CURRENT QUARTER
AS AT PRECEDING FINANCIAL YEAR END
7
Net assets per share attributable to ordinary equity holders of the parent ($$)
1.1400
1.1200

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发表于 15-3-2022 08:38 AM | 显示全部楼层
Type
Announcement
Subject
OTHERS
Description
ACCEPTANCE ON THE LETTER OF AWARD (LOA) FOR THE SUPPLY, DELIVERY, INSTALLATION, TESTING, COMMISSIONING, OPERATIONS AND MANAGEMENT OF NETWORK INFRASTRUCTURE FOR THE NEW OFFICE OF PERMODALAN NASIONAL BERHAD (PNB) AT MERDEKA 118
ACCEPTANCE ON THE LETTER OF AWARD (LOA) FOR THE SUPPLY, DELIVERY, INSTALLATION, TESTING, COMMISSIONING, OPERATIONS AND MANAGEMENT OF NETWORK INFRASTRUCTURE FOR THE NEW OFFICE OF PERMODALAN NASIONAL BERHAD (PNB) AT MERDEKA 118

1.         Introduction

HeiTech Padu Berhad (“HeiTech” or “the Company”) is pleased to announce that the Company has, on 17 December 2021, signed the LOA for The Supply, Delivery, Installation, Testing, Commissioning, Operations and Management of Network Infrastructure for the New Office of PNB at Merdeka 118.

2.         The Contract Value

The Contract Value is RM21,700,000.00 (Ringgit Malaysia Twenty-One Million Seven Hundred Thousand Only).

3.         Duration of the Contract

The Contract is for a period of 42 months. The commencement date is to be determined by PNB.

4.         The effect on net assets of HeiTech Group

The Contract will not have any effect on HeiTech Group’s net asset for the financial year ending 31 December 2021.

5.         The risks in relation to the Contract

The risks are normal risks encountered by companies undertaking a similar endeavor and the Company has taken the necessary steps to protect itself and to mitigate the risks as and when they occur.

6.         Directors' and Substantial Shareholders' Interest

None of the Directors or substantial shareholders or any person connected to the Directors or substantial shareholders of HeiTech has any interest, either direct or indirect in the above Contract.

7.         Statement of the Directors

The Board of Directors is of the opinion that the execution of the Contract is in the ordinary course of business and is in the best interest of the Company.

8.         Financial Effects

The Contract is expected to have positive effects on future earnings and earnings per share of HeiTech. Nevertheless, the Contract will have no material effect on the dividend policy, share capital and substantial shareholdings of the Company for the financial year ending 31 December 2021.

This announcement is dated 20 December 2021.



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发表于 12-9-2022 10:48 AM | 显示全部楼层
Type
Announcement
Subject
OTHERS
Description
ACCEPTANCE ON THE LETTER OF AWARD (LOA) FOR KONTRAK SENGGARAAN TACTICAL OPERATIONAL FLIGHT TRAINER (TOFT), COMPUTER BASED TRAINING (CBT), FASILITI DAN ENHANCE TRAINING AID SYSTEM (ETAS) DI BANGUNAN SIMULATOR SUKHOI 30-MKM, AIR DEFENCE SIMULATOR SYSTEM (ADSS) SERTA PENINGKATAN SISTEM SEDIA ADA.
The Board of Directors’ of HeiTech Padu Berhad (“HeiTech” or “the Company”) are pleased to announce that the Company has on 8 September 2022 signed the LOA from Ministry of Defence, Malaysia (“Mindef”) for “Kontrak Senggaraan Tactical Operational Flight Trainer, Computer Based Training, Fasiliti Dan Enhance Training Aid System Di Bangunan Simulator Sukhoi 30-MKM, Air Defence Simulator System Serta Peningkatan Sistem Sedia Ada.

Please refer to the attached file for details of the announcement.

This announcement is dated 9 September 2022.
https://www.bursamalaysia.com/market_information/announcements/company_announcement/announcement_details?ann_id=3291249

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发表于 15-9-2023 08:15 AM | 显示全部楼层
Type
Announcement
Subject
OTHERS
Description
ACCEPTANCE ON THE LETTER OF AWARD (LOA) FOR PERKHIDMATAN SEWAAN KOMPUTER RIBA MESRA ALAM YANG MEMENUHI KEPERLUAN HIJAU SECARA SEWA MILIK (LEASE TO OWN) UNTUK KEPERLUAN GURU DI SEKOLAH DAN INSTITUSI PENDIDIKAN KEMENTERIAN PENDIDIKAN MALAYSIA (KPM) BAGI ZON 7: KELANTAN DAN TERENGGANU
HeiTech Padu Berhad (“HeiTech” or “the Company”) is pleased to announce that the Company has on 13 September 2023, accepted and signed the LOA from Ministry of Education, Malaysia (“MOE”) for Perkhidmatan Sewaan Komputer Riba Mesra Alam Yang Memenuhi Keperluan Hijau Secara Sewa Milik (Lease to Own) Untuk Keperluan Guru Di Sekolah dan Institusi Pendidikan Kementerian Pendidikan Malaysia Bagi Zon 7: Kelantan Dan Terengganu.

Please refer to the attached file for details of the announcement.

This announcement is dated 14 September 2023.
https://www.bursamalaysia.com/market_information/announcements/company_announcement/announcement_details?ann_id=3385341

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发表于 3-10-2023 06:24 AM | 显示全部楼层
本帖最后由 icy97 于 3-10-2023 06:27 AM 编辑

HEITECH PADU BERHAD

Date of change
02 Oct 2023
Name
PUAN SALMI NADIA BINTI MOHD HILMEY
Age
41
Gender
Female
Nationality
Malaysia
Type of change
Others
Designation
Group Chief Executive Officer
Description
Promoted from Group Chief Operating Officer to Group Chief Executive Officer
Qualifications
No
Qualifications
Major/Field of Study
Institute/University
Additional Information
1
Masters
Masters of Science (MsC) in Management and Information System,
University of Nottingham, United Kingdom
2
Degree
Bachelor of Arts (B.A), Finance, Accounting and Management
Nottingham Trent University, United Kingdom
  
Working experience and occupation
Puan Salmi Nadia Binti Mohd Hilmey joined HeiTech in 2007. She was appointed as the Special Assistant to the GCEO in 2011 and later as Director of Corporate Development and Risk Management in 2014. Within these years, she has been responsible for all centralised functions under Corporate Services, while overseeing the operations and performance of all companies within HeiTech group.In January 2016, she was appointed as Executive Vice President, Risk Management and Corporate Services. Subsequently, Puan Salmi Nadia was appointed as the Head of Core 2, to lead more than ten (10) subsidiary companies in HeiTech Group in September 2018. She was then appointed as the Group Chief Operating Officer on 1st April 2021.She holds a number of directorships within the HeiTech Group.
Family relationship with any director and/or major shareholder of the listed issuer
She is the daughter of Dato' Sri Mohd Hilmey Bin Mohd Taib, the Executive Deputy Chairman.
Any conflict of interests that he/she has with the listed issuer
NIL
Details of any interest in the securities of the listed issuer or its subsidiaries
Direct Interest - 1,000 Ordinary Shares


Remarks :
Puan Salmi Nadia Binti Mohd Hilmey has been promoted from Group Chief Operating Officer to Group Chief Executive Officer. This appointment shall replace Dato' Sri Mohd Hilmey Bin Mohd Taib as the Group Chief Executive Officer of HeiTech Padu Berhad effective from 2nd October 2023.






Date of change
02 Oct 2023
Name
DATO' SRI MOHD HILMEY BIN MOHD TAIB
Age
70
Gender
Male
Nationality
Malaysia
Designation
Group Chief Executive Officer
Directorate
Executive
Type of change
Resignation
Reason
Due to personal commitment.
Details of any disagreement that he/she has with the Board of Directors
No
Whether there are any matters that need to be brought to the attention of shareholders
No
Qualifications
No
Qualifications
Major/Field of Study
Institute/University
Additional Information

Working experience and occupation
NIL
Family relationship with any director and/or major shareholder of the listed issuer
NIL
Any conflict of interests that he/she has with the listed issuer
NIL
Details of any interest in the securities of the listed issuer or its subsidiaries
Direct Units   :  3,866,485 Ordinary Shares (3.82%)Indirect Units : 14,342,328 Ordinary Shares (14.17%)


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发表于 11-3-2024 11:11 PM | 显示全部楼层
Notice of Interest Sub. S-hldr (Section 137 of CA 2016)
HEITECH PADU BERHAD
Particulars of Substantial Securities Holder
Name
MY E.G. CAPITAL SDN BHD
Address
Level 43A, MYEG Tower
Empire City, No. 8, Jalan Damansara
PJU 8
Petaling Jaya
47820 Selangor
Malaysia.
Company No.
201001000819 (974343-K)
Nationality/Country of incorporation
Malaysia
Descriptions (Class)
Ordinary Shares
Name of registered holder
MY E.G. CAPITAL SDN BHD
Address of registered holder
Level 43A, MYEG Tower, Empire City, No. 8, Jalan Damansara, PJU 8, 47820 Petaling Jaya, Selangor
Date interest acquired & no of securities acquired
Date interest acquired
07 Mar 2024
No of securities
14,572,300
Circumstances by reason of which Securities Holder has interest
Acquisition of shares in open market and via Direct Business Transaction.
Nature of interest
Direct Interest
Total no of securities after change
Direct (units)
14,572,300
Direct (%)
14.396
Indirect/deemed interest (units)

Indirect/deemed interest (%)
Date of notice
08 Mar 2024
Date notice received by Listed Issuer
08 Mar 2024

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ADVERTISEMENT

发表于 12-3-2024 03:08 PM | 显示全部楼层
Type
Announcement
Subject
OTHERS
Description
EXTENSION OF THE CONTRACT FOR PERKHIDMATAN PENYELENGGARAAN SISTEM APLIKASI MYIMMS SECARA KOMPREHENSIF DI JABATAN IMIGRESEN MALAYSIA (JIM).
Reference is made to the announcements dated 1st March 2021 on the Acceptance of the Letter of Award (LOA") for for Perkhidmatan Penyelenggaraan Sistem Aplikasi MYIMMS Secara Komprehensif di Jabatan Imigresen Malaysia.

HeiTech Padu Berhad (“HeiTech” or “the Company”) is pleased to announce that the Company had on 7th March 2024 accepted an Extension of the Contract for Perkhidmatan Penyelenggaraan Sistem Aplikasi MYIMMS Secara Komprehensif di Jabatan Imigresen Malaysia (JIM) ("Contract").

Please refer to the attached file for details of the announcement.

This announcement is dated 11th March 2024.
https://www.bursamalaysia.com/market_information/announcements/company_announcement/announcement_details?ann_id=3429526

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发表于 14-3-2024 12:17 AM | 显示全部楼层
Name
MY E.G. CAPITAL SDN BHD
Address
Level 43A, MYEG Tower
Empire City, No. 8, Jalan Damansara
PJU 8
Petaling Jaya
47820 Selangor
Malaysia.
Company No.
201001000819 (974343-K)
Nationality/Country of incorporation
Malaysia
Descriptions (Class)
Ordinary Shares
Details of changes
No
Date of change
No of securities
Type of TransactionNature of Interest
111 Mar 2024
1,511,600
AcquiredDirect Interest
Name of registered holder
MY E.G. Capital Sdn Bhd
Address of registered holder
Level 43A, MYEG Tower, Empire City, No. 8, Jalan Damansara, PJU 8, 47820 Petaling Jaya
Description of "Others" Type of Transaction

Circumstances by reason of which change has occurred
Acquisition of Shares in Open Market.
Nature of interest
Direct Interest
Direct (units)
16,083,900
Direct (%)
15.889
Indirect/deemed interest (units)

Indirect/deemed interest (%)
Total no of securities after change
16,083,900
Date of notice
12 Mar 2024
Date notice received by Listed Issuer
12 Mar 2024


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发表于 14-3-2024 08:45 PM | 显示全部楼层
本帖最后由 icy97 于 14-3-2024 08:51 PM 编辑

Notice of Interest Sub. S-hldr (Section 137 of CA 2016)
HEITECH PADU BERHAD
Particulars of Substantial Securities Holder
Name
ROSETTA PARTNERS SDN BHD
Address
Unit C3-2-10 Solaris Dutamas,
Jalan Dutamas 1,
Kuala Lumpur
50480 Wilayah Persekutuan
Malaysia.
Company No.
201701030670 (1244840-P)
Nationality/Country of incorporation
Malaysia
Descriptions (Class)
Ordinary Shares
Name of registered holder
ROSETTA PARTNERS SDN BHD
Address of registered holder
Unit C3-2-10 Solaris Dutamas, Jalan Dutamas 1, 50480 Kuala Lumpur, W.P. Kuala Lumpur
Date interest acquired & no of securities acquired
Date interest acquired
12 Mar 2024
No of securities
16,100,000
Circumstances by reason of which Securities Holder has interest
Acquisition of shares via Direct Business Transaction.
Nature of interest
Direct Interest
Total no of securities after change
Direct (units)
16,100,000
Direct (%)
15.905
Indirect/deemed interest (units)

Indirect/deemed interest (%)
Date of notice
13 Mar 2024
Date notice received by Listed Issuer
14 Mar 2024




Notice of Interest Sub. S-hldr (Section 137 of CA 2016)
HEITECH PADU BERHAD
Particulars of Substantial Securities Holder
Name
DATUK WIRA FARHASH WAFA SALVADOR
Nationality/Country of incorporation
Malaysia
Descriptions (Class)
Ordinary Shares
Name of registered holder
ROSETTA PARTNERS SDN. BHD.
Date interest acquired & no of securities acquired
Date interest acquired
12 Mar 2024
No of securities
16,100,000
Circumstances by reason of which Securities Holder has interest
Deemed interest by virtue of his substantial interest in Rosetta Partners Sdn Bhd pursuant to Section 8(4) of the Companies Act 2016.
Nature of interest
Deemed Interest
Total no of securities after change
Direct (units)

Direct (%)
Indirect/deemed interest (units)
16,100,000
Indirect/deemed interest (%)
15.905
Date of notice
13 Mar 2024
Date notice received by Listed Issuer
14 Mar 2024


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发表于 4-4-2024 02:26 AM | 显示全部楼层
HEITECH PADU BERHAD

Date of change
03 Apr 2024
Name
ENCIK SANDRARUBEN A/L NEELAMAGHAM
Age
37
Gender
Male
Nationality
Malaysia
Designation
Executive Director
Directorate
Executive
Type of change
Appointment
Qualifications
No
Qualifications
Major/Field of Study
Institute/University
Additional Information
1
Degree
Bachelor of Laws (LL.B)(Hons)
Universiti Kebangsaan Malaysia, Malaysia
2
Diploma
International Commercial Arbitration
The Chartered Institute of Arbitrators (CIArb)

Working experience and occupation
Mr Sandraruben A/L Neelamagham read law at Universiti Kebangsaan Malaysia (UKM) and was admitted as an advocate and solicitor of the High Court of Malaya in 2011. Additionally, he has was also awarded a Diploma in International Commercial Arbitration by The Chartered Institute of Arbitrators on 14th October 2018.He is the Managing Partner of Messrs Ahmad Deniel, Ruben & Co., a legal practice which he established in 2012 which has now developed into a mid-sized law firm in Malaysia. Apart from being the Managing Partner, he heads the Corporate Department of the firm. He is well versed in a variety of legal practice which include Commercial Litigation, Corporate & Commercial Drafting, Trust & will, Intellectual Property and Construction Law.He is also a Fellow with The Chartered Institute of Arbitrators (CIArb) and a Member of The Malaysian Institute of Arbitrators (MIArb). Additionally, he is also a registered Trademark Agent with the Intellectual Property Corporation of Malaysia (MyIPO) and a Certified Company Secretary in Malaysia. Along with his corporate advisory work for a number of public listed companies as well as international companies, he has appeared in all tiers of the Malaysia Courts, representing clients in various commercial and civil disputes ranging from tortious liabilities, shareholder disputes and corporate restructuring proceedings.Mr Sandraruben A/L Neelamagham further holds the position as a Director in Selcare Pharmacy Sdn. Bhd., a subsidiary of SELGATE Corporation Sdn. Bhd., which manages and supplies pharmaceutical products to the network of Selcare Clinic, corporate clients and customers.

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